Jack W. Holloway

After the group

Senior Technical Fellow and Director, Raytheon

PhD Dissertation

Energy efficient sub-terahertz electrical interconnect MIT DSpace ↗

Publications in the group 10

• TCAS Sep 2021

  Emerging Terahertz Integrated Systems in Silicon

  X. Yi, C. Wang, Z. Hu, J. Holloway, M. I. Khan, M. Ibrahim, M. Kim, G. Dogiamis, B. Perkins, M. Kaynak, R. Yazicigil, A. Chandrakasan, R. Han

• ISSCC Feb 2021

  A 105Gbps Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-330GHz Signal and Integrated Waveguide Coupler

  J. W. Holloway, G. C. Dogiamis, R. Han

• IEDM Dec 2020

  Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications

  A. Aleksov, G. Dogiamis, T. Kamgaing, A. Elsherbini, J. Swan, J. Holloway, R. Han

• TMTT Aug 2020

  220-to-330-GHz Manifold Triplexer With Wide Stopband Utilizing Ridged Substrate Integrated Waveguides

  J. W. Holloway, G. Dogiamis, S. Shin, R. Han

• Patent Mar 2020

  Fully Integrated Broadband Interconnect

  J. Holloway, R. Han

• MWMag Jan 2020

  Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully-Electrical Terahertz Waveguide Links

  J. Holloway, G. C. Dogiamis, R. Han

• MWMag Apr 2019

  Filling the Gap: Silicon Terahertz Integrated Circuits Offer Our Best Bet

  R. Han, Z. Hu, C. Wang, J. Holloway, X. Yi, M. Kim, J. Mawdesley

• IEDM Dec 2017

  Large-Scale Terahertz Active Arrays in Silicon Using Highly-Versatile Electromagnetic Structures

  C. Wang, Z. Hu, G. Zhang, J. Holloway, R. Han

• TMTT Jul 2017

  A Fully Integrated Broadband Sub-mmWave Chip-to-Chip Interconnect

  J. W. Holloway, L. Boglione, T. M. Hancock, R. Han

• IEDM Dec 2016

  On-Chip Terahertz Electronics: From Device-Electromagnetic Integration to Energy-Efficient, Large-Scale Microsystems

  R. Han, J. Holloway, C. Jiang, A. Mostajeran, E. Afshari, A. Cathelin, Y. Zhang, K. K. O, L. Boglione, T. Hancock, C. Wang, Z. Hu, G. Zhang