Publications
Filters
No publications match the current filters.
2026 7 papers
-
4W Heterogeneous Power Amplifier with GaN-on-Si Dielets in Single-Crystal Diamond Interposer for 6G FR3 Applications
-
Sub-Millimeter GaN-on-Si Dielet Fabrication in Advanced Packaging Substrates Using Femtosecond Laser for 3D Heterogeneous Integration Applications
-
A 55.8-to-64.2GHz, 58.3fsrms-Jitter, -250.2dB-FoMJ Fractional-N Cascaded PLL in 28nm CMOS
-
3-D-Millimeter Wave Integrated Circuits (3D-mmWIC) Using GaN-on-Si Dielets With Si CMOS for 5G FR2 Power Amplifiers
-
A 234-to-252GHz Dual-Polarized Transceiver Using Antenna-in-Package Technologies for Cross-Polarimetric Sensing
-
Self-Programmable Twin PUFs via Photovoltaic Energy Harvesting During the Pre-Wafer-Dicing Stage
-
A Cryo-CMOS Color-Center Quantum Controller with Diamond Waveguide Micro-Chiplet Integration
2025 6 papers
-
A Fully Integrated 263-GHz Retro-Backscatter Circuit with 105° Reading Angle and 12-dB Conversion Loss
-
A 55.8-to-64.2GHz, 58.3fsrms-Jitter, -250.2dB-FoMJ Fractional-N Cascaded PLL in 28nm CMOS
-
3D-Millimeter Wave Integrated Circuit (3D-mmWIC): A Gold-Free 3D-Integration Platform for Scaled RF GaN-on-Si Dielets with Intel 16 Si CMOS
-
A Bidirectional Wireless THz Datalink Designed to Maximize the Information-per-Heat Transfer to A Cryogenic Device
-
CIRCUIT: A Benchmark for Circuit Interpretation and Reasoning Capabilities of LLMs
-
A 232-260GHz CMOS Amplifier-Multiplier Chain with a Low-Cost, Matching-Sheet-Assisted Radiation Package and 11.1dBm Total Radiated Power
2024 7 papers
-
A 265-GHz CMOS Reflectarray with 98×98 Elements for 1°-Wide Beam Forming and High-Angular-Resolution Radar
-
Heterogeneous integration of spin–photon interfaces with a CMOS platform
-
The Pursuit of Practical Applications of THz CMOS Chips
-
A CMOS-Integrated Color Center Pulse-Sequence Control and Detection System
-
A Packageless Anti-Tampering Tag Utilizing Unclonable Sub-THz Wave Scattering at the Chip-Item Interface
-
A Dual Composite Resin Injection Molding Technique with 3D-Printed Flexible Indices for Biomimetic Replacement of A Missing Mandibular Lateral Incisor
-
A 1.54 mm², 264-GHz Wake-Up Receiver with Integrated Cryptographic Authentication for Ultra-Miniaturized Platforms
2023 5 papers
-
Zero-Change CMOS Nanophotonics: Converting Foundry Semiconductor Chips to Plasmonic Electro-optic Modulators
-
Perspective on Active Submillimeter Electromagnetic Wave Imaging Using CMOS Integrated Circuits Technologies
-
A 1.54mm² Wake-Up Receiver Based on THz Carrier Wave and Integrated Cryptographic Authentication
-
THz Cryo-CMOS Backscatter Transceiver: A Contactless 4 Kelvin-300 Kelvin Data Interface
-
CMOS Integrated Circuits for the Quantum Information Sciences
2022 13 papers
-
A 140-GHz FMCW TX/RX-Antenna-Sharing Transceiver with Low-Inherent-Loss Duplexing and Adaptive Self-Interference Cancellation
-
A 110-to-130 GHz SiGe BiCMOS Doherty Power Amplifier with A Slotline-Based Power Combiner
-
Physical-Layer Security for THz Communications via Orbital Angular Momentum Waves
-
Integrable Timing on Silicon Wafer Supporting CubeSats-Based Communications, Navigation and Radio Science
-
A Dual-Antenna, 263GHz Energy Harvester in CMOS for Ultra-Miniaturized Platforms with 13.6
-
A Sub-THz CMOS Molecular Clock with 20 ppt Stability at 10,000 s Based on A Dual-Loop Spectroscopic Detection and Digital Frequency Error Integration
-
Low-Loss On-Chip Passive Circuits Using C4 Layer for RF, mmWave and sub-THz Applications
-
A 0.31-THz Orbital-Angular-Momentum (OAM) Wave Transceiver in CMOS With Bits-to-OAM Mode Mapping
-
Scalable Quantum Information Processing Architecture Using A Programmable Array of Spin-Photon Interfaces
-
A 140GHz Transceiver with Integrated Antenna, Inherent-Low-Loss Duplexing and Adaptive Self-Interference Cancellation for FMCW Monostatic Radar
-
A High-Efficiency 142-182 GHz SiGe BiCMOS Power Amplifier With Broadband Slotline-Based Power Combining Technique
-
A 110-to-130GHz SiGe BiCMOS Doherty Power Amplifier with Slotline-Based Power Combining Technique Achieving ¿22dBm Saturated Output Power and ¿10
-
Electronic THz Pencil Beam Forming and 2D Steering for High Angular-Resolution Operation: A 98×98 Unit, 265GHz CMOS Reflectarray with In-Unit Digital Beam Shaping and Squint Correction
2021 11 papers
-
Emerging Terahertz Integrated Systems in Silicon
-
Sub-Terahertz Heterodyne Spectroscopy of Carbonyl Sulfide
-
Realization of In-Band Full-Duplex Operation at 300 K and 4.2 K Using Bilateral Single-Sideband Frequency Conversion
-
Integrated Circuit-to-Waveguide Slot-Array Coupler
-
Systems and Methods for Suppressing Even Harmonics in a Molecular Clock
-
High-Scalability CMOS Quantum Magnetometer with Spin-State Excitation and Detection of Diamond Color Centers
-
A 105Gbps Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-330GHz Signal and Integrated Waveguide Coupler
-
CMOS THz-ID: A 1.6-mm² Package-Less Identification Tag Using Asymmetric Cryptography and 260-GHz Far-Field Backscatter Communication
-
A Terahertz Molecular Clock on CMOS Using High-Harmonic-Order Interrogation of Rotational Transition for Medium/Long-Term Stability Enhancement
-
A 220-to-320-GHz FMCW Radar in 65-nm CMOS Using a Frequency-Comb Architecture
-
A 0.31THz CMOS Uniform Circular Antenna Array Enabling Generation/Detection of Waves with Orbital Angular Momentum
2020 12 papers
-
Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications
-
mmWave and Sub-THz Technology Development in Intel 22nm Low-Power FinFET Process
-
220-to-330-GHz Manifold Triplexer With Wide Stopband Utilizing Ridged Substrate Integrated Waveguides
-
A 3.4–4.6GHz In-Band Full-Duplex Front-End in CMOS Using a Bi-Directional Frequency Converter
-
Device for Terahertz Signal Generation and Transmitter
-
Fully Integrated Broadband Interconnect
-
THzID: A 1.6mm² Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz
-
Sub-THz CMOS Molecular Clock with 43ppt Long-Term Stability Using High-Order Rotational Transition Probing and Slot Array Couplers
-
A Terahertz FMCW Comb Radar in 65nm CMOS with 100GHz Bandwidth
-
Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully-Electrical Terahertz Waveguide Links
-
A Molecular Clock Architecture for Deep Space Inter-SmallSat Radio Occultation
-
Beyond Crypto: Physical-Layer Security for Internet of Things Devices
2019 15 papers
-
Opening Terahertz for Everyday Applications
-
Molecular Clock
-
Chip-Scale Terahertz Carbonyl Sulfide (OCS) Clock: An Overview and Recent Studies on Long-Term Frequency Stability of OCS Transitions
-
Filling the Gap With Sand: When CMOS Reaches THz
-
A CMOS-Integrated Quantum Sensor Based on Nitrogen-Vacancy Centres
-
Quantum Sensing in CMOS under Ambient Conditions: On-Chip Detection of Electronic Spin States in Diamond
-
A 32-Unit 240-GHz Heterodyne Receiver Array in 65-nm CMOS with Array-Wide Phase Locking
-
High-Precision Probing of Molecules Using THz CMOS Chips: Principles and Applications in High-Accessibility Sensors and Clocks
-
Filling the Gap: Silicon Terahertz Integrated Circuits Offer Our Best Bet
-
Principles and Prototypes of Chip-Scale Molecular Clock
-
CMOS-Integrated Diamond Nitrogen-Vacancy Quantum Sensor
-
A Scalable Quantum Magnetometer in 65nm CMOS with Vector-Field Detection Capability
-
On-Chip Detection of Spin States in Color Centers for Metrology and Information Processing
-
CMOS-Based THz Spectrometers: From Gas Sensing to Time-Keeping
-
Chip-Scale Molecular Clock
2018 9 papers
-
Wave-Matter Interactions at the Chip Scale: Devices, Systems and Opportunities
-
An On-Chip Fully-Electronic Molecular Clock Based on Sub-Terahertz Rotational Spectroscopy
-
Room-Temperature Quantum Sensing in CMOS: On-Chip Detection of Electronic Spin States in Diamond Color Centers for Magnetometry
-
Heterodyne Sensing CMOS Array with High Density and Large Scale: A 240-GHz, 32-Unit Receiver Using A De-Centralized Architecture
-
A CMOS Molecular Clock Probing 231.061-GHz Rotational Line of OCS with Sub-ppb Long-Term Stability and 66-mW DC Power
-
Molecular Detection for Unconcentrated Gas With ppm Sensitivity Using 220-to-320-GHz Dual-Frequency-Comb Spectrometer in CMOS
-
High-Power Radiation at 1 THz in Silicon: A Fully Scalable Array Using A Multi-Functional Radiating Mesh Structure
-
CMOS Terahertz Receivers
-
Metamaterial Absorber for THz Polarimetric Sensing
2017 7 papers
-
Dual-Terahertz-Comb Spectrometer on CMOS for Rapid, Wide-Range Gas Detection With Absolute Specificity
-
Large-Scale Terahertz Active Arrays in Silicon Using Highly-Versatile Electromagnetic Structures
-
Energy-Efficient Integrated THz Electronics Using Multi-Functional Electromagnetism and High-Parallelism Spectral Sensing
-
A Fully Integrated Broadband Sub-mmWave Chip-to-Chip Interconnect
-
Fully-Scalable 2D THz Radiating Array: A 42-Element Source in 130-nm SiGe with 80-μW Total Radiated Power at 1.01 THz
-
Rapid and Energy-Efficient Molecular Sensing Using Dual THz Combs in 65nm CMOS: A 220-to-320GHz Spectrometer with 5.2mW Radiated Power and 14.6–19.5dB Noise Figure
-
Devices in CMOS for Terahertz Circuits and Systems
2016 6 papers
-
Devices and Circuits in CMOS for THz Applications
-
On-Chip Terahertz Electronics: From Device-Electromagnetic Integration to Energy-Efficient, Large-Scale Microsystems
-
A Fully-integrated 320-GHz Coherent Imaging Transceiver in 130-nm SiGe BiCMOS
-
System and Method for Signal Generation
-
Design and Demonstration of 820-GHz Array Using Diode-Connected NMOS Transistors in 130-nm CMOS for Active Imaging
-
A 320GHz Subharmonic Mixing Coherent Imager in 130nm SiGe BiCMOS
2015 4 papers
-
THz Imaging Circuits in CMOS
-
A SiGe Terahertz Heterodyne Imaging Transmitter With 3.3 mW Radiated Power and Fully-Integrated Phase-Locked Loop
-
Filling the Terahertz Gap with Sand: High-Power Terahertz Radiators in Silicon
-
A 320GHz Phase-Locked Transmitter with 3.3mW Radiated Power and 22.5dBm EIRP for Heterodyne THz Imaging Systems
2013 8 papers
-
A CMOS High-Power Broadband 260-GHz Radiator Array For Spectroscopy
-
Progress Towards mW-Power Generation in CMOS THz Signal Sources
-
CMOS Sources and Detectors for Sub-Millimeter Wave Applications
-
Active Terahertz Imaging Using Schottky Diodes in CMOS: Array and 860-GHz Pixel
-
820-GHz Imaging Array Using Diode-Connected NMOS Transistors in 130-nm CMOS
-
A High-Power Broadband Passive Terahertz Frequency Doubler in CMOS
-
A 260GHz Broadband Source with 1.1mW Continuous-Wave Radiated Power and EIRP of 15.7dBm in 65nm CMOS
-
Schottky Diodes in CMOS for Terahertz Circuits and Systems
2012 4 papers
-
Terahertz Image Sensing using CMOS Schottky Barrier Diodes
-
A Broadband 480-GHz Passive Frequency Doubler in 65-nm Bulk CMOS
-
Broadband Root Mean Square Detector in CMOS for On-Chip Measurements of Millimeter-Wave Voltages
-
280GHz and 860GHz Image Sensors Using Schottky-Barrier Diodes in 0.13m Digital CMOS
2011 2 papers
-
A 280-GHz Schottky Diode Detector in 130-nm Digital CMOS
-
Phase Matching Using Bandgap Structures for Efficient Parametric Frequency Conversion
2010 4 papers
-
280-GHz Schottky Diode Detector in 130-nm Digital CMOS
-
Progress and Challenges Towards Terahertz CMOS Integrated Circuits
-
Multi-level Amplitude Modulation of a 16.8-GHz Class-E Power Amplifier with Negative Resistance Enhanced Power Gain for 400-Mbps Data Transmission
-
Diodes in CMOS for Millimeter-Wave and Submillimeter-Wave Circuits
2009 3 papers
-
Paths to Terahertz CMOS Integrated Circuits
-
Towards Terahertz Operations of CMOS
-
Millimeter-Wave to Terahertz in CMOS