JOURNAL PAPERS

A Bidirectional Wireless THz Datalink Designed to Maximize the Information-per-Heat Transfer to A Cryogenic Device
J. Wang, I. B. W. Harris, M. I. Ibrahim, D. Englund and R. Han
accepted at Nature Electronics

Heterogeneous Integration of Spin-Photon Interfaces with A Scalable CMOS Platform
L. Li, L. De Santis, I. Harris, K. Chen, I. Christen, M. Trusheim, Y. Song, Y. Gao, C. Errando-Herranz, J. Du, G. Clark, M. Ibrahim, G. Gilbert, R. Han and D. Englund
Nature, 630, 70-76 (2024)

A Dual Composite Resin Injection Molding Technique with 3D-Printed Flexible Indices for Biomimetic Replacement of A Missing Mandibular Lateral Incisor 
K. Hosaka, K. Watanabe, E. Tanaka, A. Tichy, T. Shiba, and R. Han
Journal of Prosthodontic Research, 2024

A 265-GHz CMOS Reflectarray with 98×98 Elements for 1°-Wide Beam Forming and High-Angular-Resolution Radar (PDF)
X. Chen, N. M. Monroe, G. C. Dogiamis, R. A. Stingel, P. Myers, and R. Han
IEEE Journal of Solid-State Circuits (JSSC), 2024.

A 1.54 mm2, 264-GHz Wake-Up Receiver with Integrated Cryptographic Authentication for Ultra-Miniaturized Platforms 
E. Lee, M. I. W. Khan, X. Chen, U. Banerjee, N. Monroe, R. T. Yazicigil, R. Han, A. P. Chandrakasan
IEEE Journal of Solid-State Circuits (JSSC), CICC Special Issue, vol. 59, no. 3, 2024.

CMOS Integrated Circuits for the Quantum Information Sciences (PDF)
J. Anders, M. Babaie, J. Bardin, I. Bashir, G. Billiot, E. Blokhina, S. Bonen, E. Charbon, J. Chiaverini, I. Chuang, C. Degenhardt, D. Englund, L. Geck, L. Guevel, D. Ham, R. Han, M. Ibrahim, D. Kruger, K. Lei, A. Morel, D. Nielinger, G. Pillonnet, J. Sage, F. Sebastiano, R. Staszewski, J. Stuart, A. Vladimirescu, P. Vliex, S. Voinigescu
IEEE Trans. Quantum Engineering, vol. 4, 2023.   (An Overview Paper Edited by Associate Editors J. Bardin and R. Han)

Perspective on Active Submillimeter Electromagnetic Wave Imaging Using CMOS Integrated Circuits Technologies (PDF)
K. K. O, W. Choi, R. Han
Journal of Applied Physics, vol. 133, no. 15, April 2023.

A 140-GHz FMCW TX/RX-Antenna-Sharing Transceiver with Low-Inherent-Loss Duplexing and Adaptive Self-Interference Cancellation (PDF)
X. Chen, X. Yi, M. Khan, X. Li, W. Chen, J. Zhu, Y. Yang, K. Kolodziej, N. Monroe, and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 12, Dec. 2022. (Invited)

A 110-to-130 GHz SiGe BiCMOS Doherty Power Amplifier with A Slotline-Based Power Combiner
X. Li, W. Chen, H. Wu, S. Li, X. Yi, R. Han and Z. Feng
IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 12, Dec. 2022. (Invited)

A 0.31-THz Orbital-Angular-Momentum (OAM) Wave Transceiver in CMOS With Bits-to-OAM Mode Mapping (PDF)
M. I. W. Khan, J. Woo, X. Yi, M. I. Ibrahim, R. T. Yazicigil, A. P. Chandrakasan and R. Han
IEEE Journal of Solid-State Circuits, vol. 57, no. 5, pp. 1344-1357, May 2022. (Invited)

A High-Efficiency 142-182 GHz SiGe BiCMOS Power Amplifier With Broadband Slotline-Based Power Combining Technique (PDF)
X. Li, W. Chen, S. Li, Y. Wang, F. Huang, X. Yi, R. Han and Z. Feng
IEEE Journal of Solid-State Circuits, vol. 57, no. 2, Feb. 2022.

Emerging Terahertz Integrated Systems in Silicon (PDF)
X. Yi, C. Wang, Z. Hu, J. Holloway, M. I. Khan, M. Ibrahim, M. Kim, G. Dogiamis, B. Perkins, M. Kaynak, R. Yazicigil, A. Chandrakasan, and R. Han
IEEE Transactions on Circuits and Systems -I, vol. 68, no. 9, Sept. 2021. (Invited and Highlight Article of the Journal)

Realization of In-Band Full-Duplex Operation at 300 K and 4.2 K Using Bilateral Single-Sideband Frequency Conversion (PDF)
X. Yi, J. Wang, M. Colangelo, C. Wang, K. E. Kolodziej and R. Han
IEEE Journal of Solid-State Circuits, RFIC Special Issue, vol. 56, no. 5, May 2021. (Invited)

High-Scalability CMOS Quantum Magnetometer with Spin-State Excitation and Detection of Diamond Color Centers (PDF)
M. I. Ibrahim*, C. Foy*, D. R. Englund and R. Han            (*: equal contribution, : corresponding authors)
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 3, Mar. 2021.

CMOS THz-ID: A 1.6-mm2 Package-Less Identification Tag Using Asymmetric Cryptography and 260-GHz Far-Field Backscatter Communication (PDF)
M. I. Wasiq Khan, M. I. Ibrahim, C. Juvekar, W. Jung, R. T. Yazicigil, A. P. Chandrakasan and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 2, Feb. 2021.

A 220-to-320GHz FMCW Radar Frontend in 65-nm CMOS Using a Frequency-Comb Architecture (PDF)
X. Yi, C. Wang, J. Grajal and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 2, Feb. 2021. (IEEE JSSC Popular Article)

A Terahertz Molecular Clock on CMOS Using High-Harmonic-Order Interrogation of Rotational Transition for Medium/Long-Term Stability Enhancement (PDF)
C. Wang, X. Yi, M. Kim, Q. Yang and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 2, Feb. 2021.

Beyond Crypto: Physical-Layer Security for Internet of Things Devices
R. Tugce Yazicigil, P. Nadeau, D. Richman, C. Juvekar, S. Maji, U. Banerjee, S. Fuller, M. Abdelhamid, N. Desai, M. Ibrahim, M. Khan, W. Jung, R. Han and A. Chandrakasan,
IEEE Solid-State Circuits Magazine, vol. 12, no. 4, pp. 66-78, Fall 2020. (Invited)

220-to-330-GHz Manifold Triplexer With Wide Stopband Utilizing Ridged Substrate Integrated Waveguides (PDF)
J. W. Holloway, Georgios Dogiamis, Sanghoon Shin and R. Han
IEEE Trans. on Microwave Theory and Techniques (T-MTT), vol. 68, no. 8, Aug. 2020.

Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully-Electrical Terahertz Waveguide Links
J. Holloway, Georgios C. Dogiamis, and R. Han
IEEE Microwave Magazine, vol. 21, no. 1, Jan. 2020.

Opening Terahertz for Everyday Applications
K. K. O, W. Choi, Q. Zhong, N. Sharma, Y. Zhang, R. Han, Z. Ahmad, D.-Y. Kim, K. Shattry, I. Medvedev, D. Lary, H.-J. Nam, P. Raskin, and I. Kim
IEEE Communications Magazine, vol. 57, no. 8, Aug. 2019.

Filling the Gap With Sand: When CMOS Reaches THz (PDF)
S. Naghavi, M. Taba, R. Han, M. Aseeri, A. Cathelin, and E. Afshari
IEEE Solid-State Circuits Magazine, Summer 2019.

A CMOS-Integrated Quantum Sensor Based on Nitrogen-Vacancy Centres (Link)
D. Kim*, M. I. Ibrahim*, C. Foy*, M. E. Trusheim, R. Han and D. R. Englund           (*: equal contribution, : corresponding authors)
Nature Electronics, vol. 2, July 2019.

  • Also see Nature Electronics' News and Views: "Silicon Integration for Quantum Sensing" by A. Dzurak  (PDF) and Editorial: "CMOS with a Spin" (PDF)

Chip-Scale Terahertz Carbonyl Sulfide (OCS) Clock: An Overview and Recent Studies on Long-Term Frequency Stability of OCS Transitions (PDF)
M. Kim, C. Wang, Z. Hu and R. Han
IEEE Transactions on Terahertz Science and Technology, vol. 9, no. 4, July 2019. (Invited)

A 32-Unit 240-GHz Heterodyne Receiver Array in 65-nm CMOS with Array-Wide Phase Locking (PDF)
Z. Hu, C. Wang and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 54, no. 5, May 2019. (Invited)

Chip-Scale Molecular Clock (PDF)
C. Wang, X. Yi, J. Mawdsley, M. Kim, Z. Hu, Y. Zhang, B. Perkins and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 54, no. 4, 2019. (Invited)

Filling the Gap: Silicon Terahertz Integrated Circuits Offer Our Best Bet (PDF)
R. Han, Z. Hu, C. Wang, J. Holloway, X. Yi, M. Kim, and J. Mawdesley
IEEE Microwave Magazine, vol. 20, no. 4, April 2019. (Invited)

An On-Chip Fully-Electronic Molecular Clock Based on Sub-Terahertz Rotational Spectroscopy (Link)
C. Wang, X. Yi, J. Mawdsley, M. Kim, Z. Wang, and R. Han
Nature Electronics, vol. 1, issue 7, Jul. 2018. (Cover Article)  (MIT Spotlight News)

  • Also see News & Views by John Kitching at NIST, "Molecular Clock Redux in Miniature", Nature Electronics 1, 384-385 (2018) (Link)

High-Power Radiation at 1 THz in Silicon: A Fully Scalable Array Using A Multi-Functional Radiating Mesh Structure (PDF)
Z. Hu, M. Kaynak and R. Han
IEEE Journal of Solid-State Circuits (JSSC), RFIC Special Issue, May 2018. (Invited)

Molecular Detection for Unconcentrated Gas With ppm Sensitivity Using 220-to-320-GHz Dual-Frequency-Comb Spectrometer in CMOS (PDF)
C. Wang, Bradford Perkins, Zihan Wang and R. Han
IEEE Transactions on Biomedical Circuits and Systems, vol. 12, no. 3, pp. 709-721, June 2018 (Invited)

Dual-Terahertz-Comb Spectrometer on CMOS for Rapid, Wide-Range Gas Detection With Absolute Specificity (PDF)
C. Wang and R. Han
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 12, Dec. 2017. (Invited)

A Fully Integrated Broadband Sub-mmWave Chip-to-Chip Interconnect (PDF)
J. W. Holloway, L. Boglione, T. M. Hancock, and R. Han
IEEE Trans. on Microwave Theory and Techniques (T-MTT), vol. 65, no. 7, July 2017

A Fully-integrated 320-GHz Coherent Imaging Transceiver in 130-nm SiGe BiCMOS (PDF)
C. Jiang, A. Mostajeran, R. Han, M. Emadi, H. Sherry, A. Cathelin, and E. Afshari
IEEE Journal of Solid-State Circuits (JSSC), vol. 51, no. 11, Nov. 2016

Design and Demonstration of 820-GHz Array Using Diode-Connected NMOS Transistors in 130-nm CMOS for Active Imaging (PDF)
D. Y. Kim, S. Park, R. Han, and K. K. O
IEEE Transactions on Terahertz Science and Technology, vol. 6, no. 2, Mar. 2016

A SiGe Terahertz Heterodyne Imaging Transmitter With 3.3 mW Radiated Power and Fully-Integrated Phase-Locked Loop (PDF)
R. Han, C. Jiang, A. Mostajeran, M. Emadi, H. Aghasi, H. Sherry, A. Cathelin, and E. Afshari
IEEE Journal of Solid-State Circuits (JSSC), vol. 50, no. 12, Dec. 2015. (Invited)

A CMOS High-Power Broadband 260-GHz Radiator Array For Spectroscopy (PDF)
R. Han and E. Afshari
IEEE Journal of Solid-State Circuits (JSSC), vol. 50, no. 12, Dec. 2013. (Invited)

Active Terahertz Imaging Using Schottky Diodes in CMOS: Array and 860-GHz Pixel (PDF)
R. Han, Y. Zhang, Y. Kim, D. Kim, H. Shichijo, E. Afshari and K. K. O
IEEE Journal of Solid-State Circuits (JSSC), vol. 48, no. 10, Oct. 2013

A High-Power Broadband Passive Terahertz Frequency Doubler in CMOS (PDF)
R. Han and E. Afshari
IEEE Transactions on Microwave Theory and Techniques (T-MTT), vol. 61, no. 3, Mar. 2013. (Invited)

Broadband Root Mean Square Detector in CMOS for On-Chip Measurements of Millimeter-Wave Voltages (PDF)
C. Lee, W. Choi, R. Han, H. Shichijo and K. K. O
IEEE Electron Device Letters (EDL), vol. 33, no. 6, pp. 752-754, June 2012

A 280-GHz Schottky Diode Detector in 130-nm Digital CMOS (PDF)
R. Han, Y. Zhang, D. Coquillat, W. Knap, E. Brown and K. K. O
IEEE Journal of Solid-State Circuits (JSSC), vol. 46, no. 11, pp. 2602-2612, Nov. 2011

Progress and Challenges Towards Terahertz CMOS Integrated Circuits (PDF)
E. Seok, D. Shim, C. Mao, R. Han, S. Sankaran, C. Cao, W. Knap and K. K. O
IEEE Journal of Solid-State Circuits (JSSC), vol. 45, no. 8, pp. 1554-1564, Aug. 2010

Multi-level Amplitude Modulation of a 16.8-GHz Class-E Power Amplifier with Negative Resistance Enhanced Power Gain for 400-Mbps Data Transmission (PDF)
H. Wu, R. Han, W. Lerdsitsomboon, C. Cao and K. K. O
IEEE Journal of Solid-State Circuits (JSSC), vol. 45, no. 5, pp. 1072-1079, May 2010

Millimeter-Wave to Terahertz in CMOS
K. K. O, S. Sankaran, C. Cao, E. Seok, D. Shim, C. Mao and R. Han
Int. Journal of High-Speed Electronics and Systems, vol. 19, no. 1, pp. 55-67, Jan. 2009