CONFERENCE PAPERS

The Pursuit of Practical Applications of THz CMOS Chips
R. Han
IEEE Custom Integrated Circuit Conf. (CICC), Denver, CO, Apri. 2024. (Invited)

A CMOS-Integrated Color Center Pulse-Sequence Control and Detection System
J. Wang, I. Harris, X. Chen, D. Englund and R. Han
IEEE Custom Integrated Circuit Conf. (CICC), Denver, CO, Apri. 2024

A Packageless Anti-Tampering Tag Utilizing Unclonable Sub-THz Wave Scattering at the Chip-Item Interface
E. Lee, X. Chen, M. Ashok, J. Won, A. Chandrakasan and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2024.

Zero-change CMOS Nanophotonics: Converting Foundry CMOS Chips to Plasmonic Electro-optic Modulators
M. ElKabbash, I. Harris, S. Trajtenberg-Mills, S. Bandyopadhyay, X. Chen, M. Ibrahim, R. Han, and D. Englund
Conf. on Lasers and Electro-Optics (CLEO), San Jose, CA, May 2023.

A 1.54mm2 Wake-Up Receiver Based on THz Carrier Wave and Integrated Cryptographic Authentication (PDF)
E. Lee, M. I. W. Khan, X. Chen, U. Banerjee, N. Monroe, R. Yazicigil, R. Han and A. Chandrakasan
IEEE Custom Integrated Circuit Conf. (CICC), San Antonio, TX, Apri. 2023

THz Cryo-CMOS Backscatter Transceiver: A Contactless 4 Kelvin-300 Kelvin Data Interface (PDF)
J. Wang, M. I. Ibrahim, I. B. Harris, N. M. Monroe, M. I. W. Khan, X. Yi, D. R. Englund and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2023.

Physical-Layer Security for THz Communications via Orbital Angular Momentum Waves
Jongchan Woo, Muhammad Khan, Mohamed Ibrahim, Ruonan Han, Anantha Chandrakasan and Rabia Yazicigil
2022 IEEE International Workshop on Signal Processing Systems (SiPS), Rennes, France, Nov. 2022.

Integrable Timing on Silicon Wafer Supporting CubeSats-Based Communications, Navigation and Radio Science 
A. Yen, M. Kim, L. Yi, H. Javadi and R. Han
AIAA Accelerating Space Commerce, Exploration, and New Discovery (ASCEND), Las Vegas, NV, Oct. 2022.

Scalable Quantum Information Processing Architecture Using A Programmable Array of Spin-Photon Interfaces  
L. Li, L. de Santis, I. Harris, K. Chen, Y. Song, I. Christen, M. Trusheim, C. Herranz, R. Han, and D. Englund
Conf. on Lasers and Electro-Optics (CLEO), San Jose, CA, May 2022.

A Dual-Antenna, 263GHz Energy Harvester in CMOS for Ultra-Miniaturized Platforms with 13.6% RF-to-DC Conversion Efficiency at -8dBm Input Power (PDF) (Slides)
M. I. W. Khan, E. Lee, N. Monroe, A. Chandrakasan and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Denver, CO, Jun. 2022.

A Sub-THz CMOS Molecular Clock with 20 ppt Stability at 10,000 s Based on A Dual-Loop Spectroscopic Detection and Digital Frequency Error Integration (PDF) (Slides)
M. Kim, C. Wang, L. Yi, H. Lee and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Denver, CO, Jun. 2022.

Low-Loss On-Chip Passive Circuits Using C4 Layer for RF, mmWave and sub-THz Applications
Q. Yu, G. Kim, J. Garrett, D. Thomson, G. Dogiamis, N. M. Monroe, R. Han, Y. Ma, J. Waldemer, Y. S. Nam, G. Beltran, V. Neeli, S. Ravikumar, S. Rami, C. Pelto, and E. Karl
IEEE International Microwave Symposium (IMS), Denver, CO, Jun. 2022.

Electronic THz Pencil Beam Forming and 2D Steering for High Angular-Resolution Operation: A 98×98 Unit, 265GHz CMOS Reflectarray with In-Unit Digital Beam Shaping and Squint Correction (PDF) (Slides)
N. M. Monroe, G. C. Dogiamis, R. Stingel, P. Myers, X. Chen and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2022.

A 140GHz Transceiver with Integrated Antenna, Inherent-Low-Loss Duplexing and Adaptive Self-Interference Cancellation for FMCW Monostatic Radar (PDF) (Slides)
X. Chen, M. I. Wasiq Khan, X. Yi, X. Li, W. Chen, J. Zhu, Y. Yang, K. E. Kolodziej, N. M. Monroe and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2022.

A 110-to-130GHz SiGe BiCMOS Doherty Power Amplifier with Slotline-Based Power Combining Technique Achieving >22dBm Saturated Output Power and >10% Power Back-Off Efficiency (PDF) (Slides)
X. Li, W. Chen, S. Li, H. Wu, X. Yi, R. Han and Z. Feng
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2022.

Sub-Terahertz Heterodyne Spectroscopy of Carbonyl Sulfide
L. Yi, H. Javadi, W. Zhang, J. Mckelvy, M. Kim, A. Yen and R. Han
IEEE International Frequency Control Symposium (IFCS), Jul. 2021.

A 0.31THz CMOS Uniform Circular Antenna Array Enabling Generation/Detection of Waves with Orbital-Angular Momentum (PDF) (Slides)
M. I. W. Khan, J. Woo, X. Yi, M. Ibrahim, R. Yazicigil, A. Chandrakasan and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Atlanta, GA, Jun. 2021. (Best Student Paper Award, First Place)

A 105Gbps Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-330GHz Signal and Integrated Waveguide Coupler (PDF) (Slide)
J. W. Holloway, G. C. Dogiamis and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2021.

mmWave and Sub-THz Technology Development in Intel 22nm Low-Power FinFET Process
Q. Yu, S. Rami, V. Neeli, J. Garret, J. Koo, M. Marulanda, S. Ravikumar, S. Moraka, Y. Ma, J. Waldemer, G. Liu, S. Joglekar, M. Armstrong, D. Ali, N. Monroe, R. Han, B. Sell and E. Karl
IEEE Intl. Electron Device Meetings (IEDM), Dec. 2020.

Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications
A. Aleksov, G. Dogiamis, T. Kamgaing, A. Elsherbini, J. Swan, J. Holloway and R. Han
IEEE Intl. Electron Device Meetings (IEDM), Dec. 2020.

  • Also see Research Highlights by Nature Electronics, "Electronics in an Organic Package" (Link)

A 3.4–4.6GHz In-Band Full-Duplex Front-End in CMOS Using a Bi-Directional Frequency Converter (PDF)(Slide)
X. Yi, J. Wang, C. Wang, K. E. Kolodziej and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Los Angeles, CA, Jun. 2020.

THzID: A 1.6mm2 Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz (PDF) (Slides)
M. Ibrahim, M. I. Khan, C. Juvekar, W. Jung, R. Yazicigil, A. Chandrakasan, and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2020.

A Terahertz FMCW Comb Radar in 65nm CMOS with 100GHz Bandwidth (PDF) (Slides)
X. Yi, C. Wang, M. Lu, J. Wang, J. Grajal and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2020.

Sub-THz CMOS Molecular Clock with 43ppt Long-Term Stability Using High-Order Rotational Transition Probing and Slot Array Couplers
C. Wang, X. Yi, M. Kim and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2020.   (PDF) (Slides)

A Molecular Clock Architecture for Deep Space Inter-SmallSat Radio Occultation
Lin Yi, Mina Kim, Zhi Hu, Chi Ao, Eric Burt, Robert Tjoelker, Imran Mehdi, and Ruonan Han
Institute of Navigation (ION) Precise Time and Time Interval Systems and Applications (PTTI) Meeting, Jan. 2020.

Principles and Prototypes of Chip-Scale Molecular Clock (Video)
R. Han, C. Wang, M. Kim, X. Yi, Z. Hu and J. Mawdesley
IEEE International Frequency Control Symposium (IFCS), Orlando, FL, April 2019. (Invited)

High-Precision Probing of Molecules Using THz CMOS Chips: Principles and Applications in High-Accessibility Sensors and Clocks (PDF)
C. Wang, M. Kim, Z. Hu and R. Han
invited talk at IEEE Global Symp. on Millimeter Waves (GSMM), Sendai, Japan, May 2019.

Quantum Sensing in CMOS under Ambient Conditions: On-Chip Detection of Electronic Spin States in Diamond
C. Foy, M. I. Ibrahim, D. Kim, D. Englund, R. Han, M. Trusheim
Conf. on Lasers and Electro-Optics (CLEO), San Jose, CA, May 2019.

CMOS-Integrated Diamond Nitrogen-Vacancy Quantum Sensor
C. Foy, M. I. Ibrahim, D. Kim, M. Trusheim, D. Englund, R. Han
Bulletin of the American Physical Society (APS), Boston, MA, Mar. 2019.

A Scalable Quantum Magnetometer in 65nm CMOS with Vector-Field Detection Capability (PDF) (Slides)
M. I. Ibrahim, C. Foy, D. Englund and R. Han
IEEE Intl. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2019.

Room-Temperature Quantum Sensing in CMOS: On-Chip Detection of Electronic Spin States in Diamond Color Centers for Magnetometry
M. I. Ibrahim*, C. Foy*, D. Kim*, D. R. Englund and R. Han (* Equal Contribution)
IEEE VLSI Circuits Symposium, Honolulu, HI, Jun. 2018 (PDF) (Slides)

A CMOS Molecular Clock Probing 231.061-GHz Rotational Line of OCS with Sub-ppb Long-Term Stability and 66-mW DC Power
C. Wang, X. Yi, M. Kim, Y. Zhang and R. Han
IEEE VLSI Circuits Symposium, Honolulu, HI, Jun. 2018. (Selected as the Technical Highlight of the Conference)  (PDF) (Slides)

Heterodyne Sensing CMOS Array with High Density and Large Scale: A 240-GHz, 32-Unit Receiver Using A De-Centralized Architecture
Z. Hu, C. Wang and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Philadelphia, PA, Jun. 2018. (PDF) (Slides)

CMOS-Based THz Spectrometers: From Gas Sensing to Time-Keeping
C. Wang, Z. Hu, J. Mawdsley, M. Kim, Y. Xiang and R. Han
IEEE Radio & Wireless Week/Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Orlando, FL, Jan. 2019.

Metamaterial Absorber for THz Polarimetric Sensing
B. Wang, A. Sadeqi, R. Ma, P. Wang, W. Tsujita, K. Sadamoto, Y. Sawa, H. Nejad, S. Sonkusale, C. Wang, M. Kim, and R. Han
SPIE Photonics West, San Francisco, CA, Jan. 2018.

Wave-Matter Interactions at the Chip Scale: Devices, Systems and Opportunities (PDF)
R. Han
IEEE 14th Intl. Conf. Solid-State & Integrated Circuit Tech., Qingdao, China, Nov. 2018. (Invited)

CMOS Terahertz Receivers
Q. Zhong, W.-Y. Choi, D.-Y. Kim, Z. Ahmad, R. Xu, Y. Zhang, R. Han, S. Kshattry, N. Sharma, Z.-Y. Chen, D. Shim, S. Sankaran, E.-Y. Seok, C. Mao, F. C. DeLucia, J. P. McMillan, C. F. Neese, I. Kim, I. Momson, P. Yellswarapu, S. Dong, B. Pouya, P. Byreddy, Z. Chen, Y. Zhu, S. Ghosh, T. Dinh, F. Jalalibidgoli, J. Newman, K .K. O
IEEE Custom Integrated Circuits Conference (CICC), San Diego, CA, April 2018. (Invited)

Large-Scale Terahertz Active Arrays in Silicon Using Highly-Versatile Electromagnetic Structures  (PDF)(Slides)
C. Wang, Z. Hu, G. Zhang, J. Holloway and R. Han
IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 2017. (Invited)

Energy-Efficient Integrated THz Electronics Using Multi-Functional Electromagnetism and High-Parallelism Spectral Sensing
Z. Hu, C. Wang and R. Han
IEEE International Midwest Symposium on Circuits and Systems, Boston, MA, Aug. 6-9, 2017 (invited)

Fully-Scalable 2D THz Radiating Array: A 42-Element Source in 130-nm SiGe with 80-μW Total Radiated Power at 1.01 THz (PDF)(Slides)
Z. Hu and R. Han
IEEE Radio-Frequency Integrated Circuit Symposium (RFIC), Honolulu, Hawaii, Jun. 2017. (Best Student Paper Award, 2nd Place)

Devices in CMOS for Terahertz Circuits and Systems
Z. Ahmad, W. Choi, N. Sharma, J. Zhang, Q. Zhong, D.-Y. Kim, Z. Chen, Y. Zhang, R. Han, D. Shim, S. Sankaran, E.-Y. Seok, C. Cao, C. Mao, R. M. Schueler, I. R. Medvedev, D. J. Lary, H.-J. Nam, P. Raskin, F. C. DeLucia, J. P. McMillan, C. F. Neese, I. Kim, I. Momson, P. Yellswarapu, S. Dong, Z. Chen, K .K. O
232nd Electro Chemical Society Meeting, 2017. (Invited)

Rapid and Energy-Efficient Molecular Sensing Using Dual THz Combs in 65nm CMOS: A 220-to-320GHz Spectrometer with 5.2mW Radiated Power and 14.6~19.5dB Noise Figure (PDF)(Slides)
C. Wang and R. Han
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2017

On-Chip Terahertz Electronics: From Device-Electromagnetic Integration to Energy-Efficient, Large-Scale Microsystems (PDF)
R. Han, J. Holloway, C. Jiang, A. Mostajeran, E. Afshari, A. Cathelin, Y. Zhang, K. K. O, L. Boglione, T. Hancock, C. Wang, Z. Hu, G. Zhang
IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 2016. (Invited)

Devices and Circuits in CMOS for THz Applications
K. K. O, Z. Ahmad, W. Choi, N. Sharma, J. Zhang, Q. Zhong, D.-Y. Kim, Z. Chen, Y. Zhang, R. Han, D. Shim, S. Sankaran, E.-Y. Seok, C. Cao, C. Mao, I. R. Medvedev, D. Lary, H.-J. Nam, P. Raskin, F. C. DeLucia, I.-S. Kim, I. Momson, P. Yellswarapu, S. Dong, B.-K. Kim
IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 2016. (Invited)

A 320GHz Subharmonic Mixing Coherent Imager in 130nm SiGe BiCMOS
C. Jiang, A. Mostajeran, R. Han, H. Sherry, A. Cathelin, and E. Afshari
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2016

THz Imaging Circuits in CMOS
Z. Ahmad, D. Kim, R. Han, W. Choi, and K. K. O
IEEE Asia-Pacific Microwave Conference (APMC), Dec. 2015 (Invited).

Filling the Terahertz Gap with Sand: High-Power Terahertz Radiators in Silicon (PDF)
R. Han and E. Afshari
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Boston, MA, Oct. 2015 (Invited).

A 320GHz Phase-Locked Transmitter with 3.3mW Radiated Power and 22.5dBm EIRP for Heterodyne THz Imaging Systems (PDF)
R. Han, C. Jiang, A. Mostajeran, M. Emadi, H. Aghasi, H. Sherry, A. Cathelin, and E. Afshari
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2015

A 260GHz Broadband Source with 1.1mW Continuous-Wave Radiated Power and EIRP of 15.7dBm in 65nm CMOS (PDF)
R. Han and E. Afshari
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2013.

Progress Towards mW-Power Generation in CMOS THz Signal Sources
E. Afshari, and R. Han
European Microwave Conference, Nuremberg, Germany, Nov. 2013. (Invited)

820-GHz Imaging Array Using Diode-Connected NMOS Transistors in 130-nm CMOS
D. Kim, S. Park, R. Han, and K. K. O
IEEE VLSI Circuits Symposium, Kyoto, Japan, Jun. 2013

Schottky Diodes in CMOS for Terahertz Circuits and Systems
Y. Zhang, R. Han, D. Kim, D. Shim, E. Seok, and K. K. O
IEEE Radio and Wireless Symp. (RWS), Austin, TX, Jan. 2013

CMOS Sources and Detectors for Sub-Millimeter Wave Applications
D. Shim, Y. Zhang, R. Han, D. Y. Kim, Y. Kim, S. Park, E. Seok, and K. K. O
Asia-Pacfic Microwave Conference, Seoul, Korea, Nov. 2013. (Invited)

280GHz and 860GHz Image Sensors Using Schottky-Barrier Diodes in 0.13m Digital CMOS (PDF)
R. Han, Y. Zhang, Y. Kim, D. Kim, H. Shichijo, E. Afshari and K. K. O
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2012

A Broadband 480-GHz Passive Frequency Doubler in 65-nm Bulk CMOS (PDF)
R. Han and E. Afshari
IEEE Radio Frequency Integrated Circuit Symp. (RFIC), Montreal, Canada, Jun. 2012. (Best Student Paper Award (2nd))

Terahertz Image Sensing using CMOS Schottky Barrier Diodes
R. Han, Y. Zhang, Y. Kim, D. Kim, H. Shichijo, and K. K. O
IEEE Intl. SoC Design Conf. (ISOCC), Jeju, Korea, Nov. 2012. (Invited)

Phase Matching Using Bandgap Structures for Efficient Parametric Frequency Conversion
M. Adnan, R. Han, and E. Afshari
Proc. of European Microwave Conf., Manchester, UK, Oct. 2011.

280-GHz Schottky Diode Detector in 130-nm Digital CMOS (PDF)
R. Han, Y. Zhang, D. Coquillat, J. Hoy, H. Videlier, W. Knap, E. Brown and K. K. O
IEEE Custom Integrated Circuit Conf. (CICC), San Jose, CA, Sept. 2010. (Helic Student Scholarship Award)

Towards Terahertz Operations of CMOS (PDF)
S. Sankaran, C. Mao, E. Seok, D. Shim, C. Cao, R. Han, D. Arenas, D. Tanner, S. Hill, C. Hung, and K. K. O
IEEE Int. Solid-State Circuit Conf. (ISSCC), San Francisco, CA, Feb. 2009

Paths to Terahertz CMOS Integrated Circuits
D. Shim, C. Mao, R. Han, S. Sankaran, E. Seok, C. Cao, W. Knap and K. K. O
IEEE Custom Integrated Circuits Conf. (CICC), San Jose, CA, Sept. 2009. (Invited)

Diodes in CMOS for Millimeter-Wave and Submillimeter-Wave Circuits
C. Mao, D. Shim, R. Han, S. Sankaran, E. Seok, Y. Zhang, and K. K. O
Intl. Symp. on VLSI Tech., System, and Applications, Hsinchu, Taiwan, April 2010

A Delay Model for SRAM-based FPGA Interconnects
Y. Wang, L. Wang, R. Han and J. Tong
IEEE Int. Midwest Symp. on Circuit and System (MWSCAS), Montreal, Canada, Aug. 2006